Two-Dimensional Materials and van der Waals Heterostructures as Effective Heat Spreaders for Thermal ManagementClick to copy article linkArticle link copied!
- Dharma Darren RamDharma Darren RamInstitute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, MalaysiaMore by Dharma Darren Ram
- Nurain Najihah Alias*Nurain Najihah Alias*E-mail: [email protected]Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, MalaysiaMore by Nurain Najihah Alias
- Muhammad Feidhul Hakim Fatah YasinMuhammad Feidhul Hakim Fatah YasinInstitute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, Malaysia
- Poh Choon OoiPoh Choon OoiInstitute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, MalaysiaMore by Poh Choon Ooi
- Mohd Ambri MohamedMohd Ambri MohamedInstitute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, MalaysiaMore by Mohd Ambri Mohamed
- Akrajas Ali UmarAkrajas Ali UmarInstitute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, MalaysiaMore by Akrajas Ali Umar
- Abdul Manaf HashimAbdul Manaf HashimAdvanced Devices and Material Engineering Research Lab, Department of Electronic Systems Engineering, Malaysia-Japan International Institute of Technology, Universiti Teknologi Malaysia, 51400 Kuala Lumpur, MalaysiaMore by Abdul Manaf Hashim
- Muhammad Aniq Shazni Mohammad Haniff*Muhammad Aniq Shazni Mohammad Haniff*E-mail: [email protected]Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, MalaysiaAdvanced Devices and Material Engineering Research Lab, Department of Electronic Systems Engineering, Malaysia-Japan International Institute of Technology, Universiti Teknologi Malaysia, 51400 Kuala Lumpur, Malaysia
Abstract
The increasing power density and miniaturization of electronic devices demand efficient thermal management to prevent overheating and performance loss. Conventional thermal interface materials (TIMs) often struggle with the high heat flux in modern electronics, leading to interest in advanced options like two-dimensional van der Waals heterostructures (2D vdWHs). These materials, with their atomically thin layers and high in-plane thermal conductivity, enable efficient heat transfer across the interfaces. By rapidly dissipating heat, these materials improve device performance and durability, offering a promising solution for managing thermal challenges in next-generation electronics. From both theoretical and experimental views, we summarize the thermal properties of 2D materials and vdWHs, particularly graphene, hexagonal boron nitride (hBN), MXenes, and transition metal dichalcogenides (TMDs) as cutting-edge heat spreaders for high-powered electronics. This review delves into the basics of thermal transport, highlighting phonon-driven conduction, and reviews key models like ab initio calculations and molecular dynamics simulations to understand atomic-scale thermal transport. Key measurement methods and thermal properties of these materials are also discussed in detail. The review also considers the applications of both vertical and lateral vdWHs that enhance overall device performance and addresses material transfer challenges, highlighting future directions to improve thermal management in high-powered electronics.
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